The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder
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| Title | The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder |
| Authors | |
| Abstract | Surface conditions on Printed Circuit Board (PCB) final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows. |
| Publisher | Faculty of Mechanical Engineering University of Zilina, Slovak Republic |
| Date | 2012-11-13 |
| Source | Materials Engineering - Materiálové inžinierstvo (MEMI) Vol 20, No 1 (2013) |
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